Highokary temperaturaly Teflon ýokary temperatura lentasynyň süýşmegine garşylyk we uzak möhletli durnuklylygy nädip gowulandyryp bolar?

I.MolecularNetworkTopologySiliconeAdhesiveLayer - OptimizationBulkCreepResistance

1.HighMQResin / SiliconeRubberRatioand 'Gaty ýadro ' gurluşy

Öndüriji önümlerMQsiliconeresinasthecoretackifierandreinforcingagent, artýanMQ / gumratioto1.2: 1–2: 1 (ep-esli derejede ýokary derejeli). gaty 'gaty fazaly ' mikrodomainler bilen işleýän başlyk, 'Filoksanechainsegment' -iň gurluşy, '' '' '' '' '' '' '' '

2.Heat-çydamlyRigidGroupsandHigh-Bond-EnergyCrosslinkingSites

Fenil, difenil, orkarboranegrouplar öndürilen tintolimetilsiloksanebackbone (meselem, 20-30mol% fenilkontent) tondertermalchainmotionandraiseboththeglasstransitiontemperatureandthe rmaldecompositiontemperature.

3.ControlofMolecularWeightBetweenCrosslinks (Mak) we NetworkDefects

Düwürtikli wodorod-kontentent we zynjyr uzynlygy, gidrojen-konteýnsilikoneoil, arelativelysmallanduniformMc (takmynan 5,000-15,000g / mol) sazlanýar Işleýiş derejesi, ýokary derejeli temperatura.

II.GradientModulusMultilayerAdhesiveStructure - BalancingTackandCreepResistance

'Primer-labyr oýnaýjy + -okary modully birleşdiriji + Viskoelastiki funksional oýunçy ' üç gatly dizaýn

1.Primer-labyr oýnaýjy (1–3μm): “ PoliesizedwithMQresin”, “toprovidebothchemicalbondingtothePTFEsubstrateandco-crosslinkingwithuppersiliconelayer” ulanylýar.

2. -okary modully birleşdiriji (esasy adam, takmynan 30–50μm): Useshigh-MQ gatnaşygy, ýokary fenil mazmuny, ýokary baglanyşyk-dykyzlygy silikoneadhesivetofurnisharobustshear-garşylykly skelet.

3.Wiskoelastiki funksional oýunçy (biri-biri bilen baglanyşyksyz, 3–8μm): Işleýänler-MQ-gatnaşygy bolan gidroksi-terminli silikon-ýagy üýtgedilenler

III.Nanofiller

1.In-SituReinforcement we SurfaceModificationofNano-Silika

Öndürijilerfumedsilika (spesifikasiýa ýerüsti200–380m² / g), ýerüsti bejergisi bilen wintiltrietoksisilaneorheksametildisilazane, ataloadingof 10–25wt% .Tenano-SiO₂formshydrogenbondsandphysicaladsorptionwithsilox. tersine öwrüliýän fiziki ulgamlar

2.DirectionalCreepResistancevia2DNanomateriallar

Goşmaça1–5wt% az gatlakly grafenororgano-üýtgedilen-montmorillonit zolak

IV.ChemicallyIntegratedSubstrate - AdhesiveInterfaceandProcessControl

1.SurfaceActivation weBifunctionalPrimerforChemicalBonding

ThePTFEsurfaceisfirsttreatedwitazodium - naftalin - THFsolutionorlow-pressargon / kislorod plazmatogenerateanactivatedlayerconboxylandhydroxylgroups. ated.

2.RampedCuringandPost-TreatmentEliminateDefects

“Arampedcuringprofileis” işleýänler: ilki bilen, “erginler”, “100–100 ° C” erginler; -200220 ° Cforseveralhourstoeliminateinternalstress we stabilizephysicalcrosslinkingpoint.Slowcoolingpreventsmicrocrackingduetodifferentialthermalshrinkage.

Theaboveinformasiýa berilýärJiangsuAokaiNewMaterialTechnologyCo., Ltd.

Ifyouwouldliketogainin-çuňňur bilimler, şol sandaTeflonhigh-temperaturefabrika, Teflonhigh-temperaturetape, Teflonhigh-temperaturemeltbelt, seamlessconveyorbeltsforbondingmachines, bir taraplyPTFEfabrika, ýokary temperatura çydamly konweýerbelts, ýokary temperatura çydamly süýümli aýna önümçiligi we başga-da, şol bir wagtyň özünde spesifikasiýa, amaly programmalar we müşderi çözgütleri, özüňiz bilen aragatnaşyk saklaň.

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